COOL 519 - Cooling Shipboard Electronics
Day One
Introduction
- Simplified Heat Transfer/Fluid Flow Algorithms
- Determining Enclosure Cooling Air Flow Requirements
- Procedures for determining Pressure Drop (Flow Impedance)
- Acoustic Considerations, Estimating dBA
Forced Cooled, Vented Enclosures
- Developing Enclosure Air Flow Circuit
- Blower/Fan(s) Cooled Enclosure Designs
- Estimating Overall Enclosure Flow Impedance
- Enclosure Multiple Internal Flow Paths
- Blower/Fan(s) Enclosure Placement
- Enclosure Positive/Negative Internal Pressure Levels
- Estimating Enclosure Thermal Profiles (Forced Air)
Day Two
Naturally Cooled, Vented Enclosures
- Buoyancy/Floatation Pressure Rise
- Evaluating Induced Draft Air Flow
- Sizing Inlet/Exhaust Air Flow Openings
- Forced Draft Multiple Flow Paths
- Estimating Enclosure Thermal Profiles (Naturally Cooled-Vented)
Naturally Cooled, Non-Vented
- Estimating Enclosure Internal Air Draft Recirculation
- Spatial Positioning of Internally Mounted Electronic Equipment
- Determining Effective Enclosure Draft Height
- Multiple Draft-induced Flow Paths
- Estimating Enclosure Thermal Profiles (Naturally Cooled-Nonvented)
Day Three
Heat Sink Design
- Designing Customized Naturally Forced Air Cooled Heat Sinks
- Heat Sinks Utilizing Straight and Pin Fin Geometries
- Effects of Heat Sink Attitude
- Radiation Cooling Effects
- Liquid Cooled Heat Sinks
Special Topics
- Micro-channel Heat Sink Design
- Water Cooled Enclosure Design
- Air/Liquid Heat Exchanger Design
- Humidity Considerations/Understanding Psychometrics
- System Thermal Testing
- Problem Solving Workshop “Bring Your Problems”