COOL 520 - Cooling of Electronic Assemblies
Introduction to electronics heat sources
Temperature limits; standards and specifications
Terminology: thermal resistance; convection, radiation, and conduction
Circuit board cooling
- Conduction cooled boards utilizing ground planes and thermal VIAs
- Metal core boards, hollow core boards
- Forced air cooling of printed wiring boards (PWBs)
- Naturally-cooled printed wiring boards
Forced air cooling of enclosures
- Determining enclosure air flow requirements
- Overall flow impedance (pressure drop)
- Fan/blower operation and overall system performance
- Acoustical noise considerations
- Liquid (including spray) cooling of enclosures
- Air conditioned enclosures (use of refrigeration)
Naturally cooled non-vented enclosures
- Plastic enclosures
- EMI may not permit enclosure venting
- Phase change material (PCM) cooling of enclosures
- Cooling of solar irradiated enclosures
- Cooling of portable enclosures
Naturally cooled vented enclosures
- Buoyancy induced draft cooling
- Design procedures for short/tall chimney-cooled enclosures
- Selecting ventilated (perforated) open area
- Selecting optimum PCB pitch for minimum temperature rise
- Design example: a 1.0 KW enclosure cooled by buoyancy induced draft
Natural/forced air cooled heat sinks
- Straight fins vs. pin fins
- Brazed, extruded and cast heat sinks
- High altitude performance
- Radiation cooling effects
- Micro channel heat sink design
Electronics cooling in vacuum aboard space vehicles
Humidity considerations/Understanding psychometrics
Fundamentals of flow/thermal network modeling
“Rules of thumb” for electronic cooling
Problem solving
Laboratory visit
