COOL 514 - POD Thermal Management
DAY 1
Thermal Resistance, basic relationships of Convection, Conduction, Radiation
Circuit Board Cooling
- forced convection (direct air contact cooling)
- conduction
- hollow core
Phase Change Material (PCM) Cooling
Estimating Flow Impedance
- develop overall flow circuit
- develop spread sheet calculation procedure
- evaluate system impedance
Humidity & Psychometrics Evaluation
Heat Sink Design Procedures
- straight fins
- pin fins
- attitude sensitivity
- radiation effects
- empirical data for heat transfer coefficients
DAY 2
Heat Exchanger Design and Characterization
- effectiveness vs NTU method
- empirical data for heat transfer coefficients and friction factors
- developing heat exchanger performance curves
Closed liquid loops
- ambient cooled
- refrigerant cooled
- pumps and filter performance
- estimating liquid volume expansion
- refrigerant P-H curves
- refrigerant compressor and performance curves
Review of ram air side algorithms
- stagnation, boundary layer, static temperatures
DAY 3
Vapor Cycle System (VCS) Performance
- evaporator and condenser thermal performance
- overall VCS thermal performance
Ram scoop performance
- induced flow and pressure recovery
Expanded ram Air Cycle System machine performance
- Turbine/compressor performance
- Closed cycle performance
Ram cooled Moldline Heat Exchanger Design
