Liquid Cooling for Electronics
(COOL 500)
Quick review of fundamentals
Review of basic system choices and the hardware
- pumps, radiators, expansion chamber, filter, couplings
Thermo-fluid analysis of the heat exchangers
- Fins
- Micro channels
- Liquid to air heat exchanger
- Other options (brief discussion on emerging technologies)
Analysis of heat sink material choices
Working fluid selection
- materials compatibility
- environment compatibility
- performance metrics
Pump selection considerations
- hardware options
- reliability concerns
- acoustics
System level integration issues
- System configuration
- Effects of short- and long-term temperature or altitude exposure
- Power density metrics for various approaches
- Transient operation
System design optimization considerations
- Overall system pressure drop
- Mass flow rates
- Weight considerations
- Heat exchanger fabrication techniques
- Pressure relief valves
Case examples
- Do’s and Don’ts