COOL 508 - Liquid Cooling for Electronics
Day One
Introduction
- Simplified Heat Transfer Algorithms used in Design Procedures
- Cooling Parallel/Serial Connected Flow Impedances
- Typical Liquid Coolants
- Estimating Overall System Flow Impedance
Quiescent System Operation
- Pump Types and Flow Characteristics
- Determining Overall System Operating Point
- Liquid Cooled Heat Sink Design Procedures (Straight, Tubular, Pin Fins)
Day Two
Liquid Coolant Recirculation Loops
- Air/Liquid Heat Exchanger Design Procedures
- Closed Liquid-Loop Evaluation, Ambient Cooled
- Closed Liquid Loop Evaluation, Refrigerant Cooled
Liquid-Cooled System Platforms
- Converting Air-Cooled Electronic Packages to Liquid Cooling at Minimum Cost
- Moldline Heat Exchanger Design Procedures
- Conditioning Enclosures with Re-circulated Liquid Obtained from an Air/Liquid Heat
- Exchanger
Day Three
Liquid-Loop Discrete Component Flow Impedance
- Additional Components used in Closed Liquid Loop Systems
- Quick Disconnect Usage
- Required Expansion Chamber Volume
- Plumbing Line Size
Thermal Testing
- Microchannel Liquid Heat Sink Design Procedures
- Immersion Cooling
- Spray Cooling
- Liquid Boil-off
- Heat Pipe Technology
- Problem Solving Workshop “Bring Your Problems”