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Short courses that can be held at
your facility
Acoustics
Calibration
Clean Rooms
Climatics
Cooling of Electronics
Contaminants and Corrosion
Electrostatic
Discharge (ESD)
Electromagnetic Compatibility (EMC)
Measurement
Pressure
Reliability
Spec (Specification, Test)
Strain
Stress
Acoustics
ACO
501 - Basic Acoustics
Basic acoustics, vibration and noise, instrumentation, measurement procedures
and standards, test spaces, acoustic materials, laboratory demonstrations,
data reduction, data analysis, setting up a test program, documentation
and reporting.
NOISE 510 - Basic
acoustics, vibration and noise, instrumentation, measurement procedures
and standards, test spaces, acoustic materials, laboratory demonstrations,
data reduction, data analysis, setting up a test program, documentation
and reporting.
Calibration
PRE 501 - Dynamic Pressure
Measurements and Calibration
There are many ways to get bad data. This short course details how to
avoid these sources of error in static and especially dynamic (changing)
pressure situations. Topics include sensor selection, location, calibration
and signal processing.
PRE 510 - Pressure Calibration for the Standards Laboratory
The success of any calibration or metrology program, where calibrating pressure instrumentation is a major portion of the workload, depends on the calibration of instruments, on the documentation, on data management and retention, on quality systems, and on communications within the organization.
Whether the prospective participant is an experienced metrologist or new to the field, this 2-day course will provide him/her with useful knowledge about not only pressure calibration but for any effective and compliant calibration program.
CLI 550 - Temperature Calibration for the Standards Laboratory
The success of any calibration or metrology program, where calibrating temperature instrumentation is a major portion of the workload, depends on the calibration of instruments, on the documentation, on data management and retention, on quality systems, and on communications within the organization.
Whether the prospective participant is an experienced metrologist or new to the field, this 2-day course will provide him/her with useful knowledge about not only temperature calibration but for any effective and compliant calibration program.
Clean Rooms
PAR 501 - Airborne
Particle Measurement Procedures
Airborne particles are a "no no" in several engineering situations. These
include "clean rooms" where microelectronics units are fabricated, food
processing plants, pharmacological plants, etc. The number of particles
per cubic meter must be accurately counted.
Climatics
CLI
501 - Climatic Environmental Testing
Some hardware (such as military) must be used in unfavorable climatic
conditions of high/low temperature, high/low humidity, at altitude, underwater,
in sand-and-dust conditions and other potentially damaging situations.
Using special-purpose environmental test chambers, the survivability of
hardware is assessed.
CLI 550 - Temperature Calibration for the Standards Laboratory
The success of any calibration or metrology program, where calibrating temperature instrumentation is a major portion of the workload, depends on the calibration of instruments, on the documentation, on data management and retention, on quality systems, and on communications within the organization.
Whether the prospective participant is an experienced metrologist or new to the field, this 2-day course will provide him/her with useful knowledge about not only temperature calibration but for any effective and compliant calibration program.
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Cooling
COOL 500 series (courses
provided by Joel Newberger. The following
topics can be combined to better fit
your
training needs. For more information
or "tailoring" needs, send us an e-mail)
COOL 501 - Thermal Design of Electronic
Enclosures Exposed to Diurnal Cycles
Considers solar illumination, nocturnal radiation to sky vault temperature;
limiting internal ambient temperature, limiting internal condensation,
estimating solar infiltration; strategic placement of insulation to minimize
solar infiltration; learn how external surface emissivity and absorptivity
affect enclosure thermal profiles; enclosure selection; using solar shields.
COOL 502 - Cost-Effective
Cooling of Electronics
Commences with review of basic convection, conduction, and radiation
heat transfer; natural and forced air and liquid cooling; predicting
internal enclosure ambient temperature levels; estimating required fan
flow to limit chip junction temperature to reliable levels; calculating
system flow impedance ΔP; and thermal design of air/liquid naturally/forced
cooled heat sinks; indoor/outdoor thermal enclosure design.
COOL 503 - Design of Air/Liquid
Cooled Heat Sinks and Cold Plates
You will learn about thermal design procedures associated with extruded,
cast, and brazed heat sinks and cold plates; air/liquid coolants, estimating
flow impedance ?P, generating thermal performance maps that allows predicting
temperature at any induced flow rate; evaluating thermal spreading gradients
with non-uniform heat loading; naturally-cooled/forced heat sink thermal
designs based on empirical data.
COOL 504 - Design of Naturally-Cooled,
Un-vented Enclosures
We will discuss natural convection heat transfer and buoyancy relationships;
calculating enclosure internal ambient temperature profiles using spread
sheet format; learn how to estimate enclosure internal flow impedance
ΔP; estimating induced buoyancy flow; evaluate enclosure surface thermal
impedance when used as an external ambient heat sink; power supply enclosure
placement; estimating enclosure daytime outdoor operation when solar
illuminated and then chilled by night sky vault temperature.
COOL 505 - Design of Naturally-Cooled,
Vented Enclosures
We will discuss natural convection heat transfer and buoyancy relationships;
calculating enclosure internal ambient temperature profiles using spread
sheet format; vent opening placement, estimating enclosure flow impedance
at induced air flow powered by dissipated heat; utilizing cooling effects
of infiltration/exfiltration thru vertical surface perfs (openings);
estimate how enclosure thermal profiles are effected by altitude.
COOL 506 - Design of Forced (Fan) Cooled Enclosures
Here we discuss forced convection heat transfer and fluid dynamics; you
will learn how to estimate overall system flow impedance (spread sheet
format); how to use multiple air movers when connected in parallel
or in series, fan(s) performance curves, predicting system operating
point with single or multiple fans; how to calculate required system
flow based on PCB spacing, required slot air velocity, and allowable
chip junction temperature; power supply placement; acoustical considerations
when selecting air movers; calculating flow impedance associated with
enclosure perfs (openings), dust and EMI filters.
COOL 507 - Design of Liquid-Cooled
Enclosures
You will learn about forced convection heat transfer and fluid dynamics;
selecting a liquid coolant, learn to estimate local and overall flow
impedance; using pump(s) performance and system flow impedance curves,
determine system flow (in gallons or liters per minute); learn how to
determine required filter capacity; conditioning enclosure recirculated
coolant in an air/liquid heat exchanger; design/selection of liquid heat
sinks and cold plates.
COOL 508 - Liquid Cooling for Electronics
Participants in this wide-application course will learn about heat transfer
and fluid dynamics; coolant selection, determine required coolant flow; estimate
overall system flow impedance ΔP; evaluate pump characteristics and selection;
determine system operating point; conditioning recirculated enclosure air
in an air/liquid heat exchanger, conditioning enclosure recirculated liquid
in an air/liquid heat exchanger; design and selection of liquid heat sinks
and cold plates; determine when to consider immersion cooling, spray cooling,
and evaporative cooling.
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COOL
509 - Conduction-Cooled Circuit Boards
Utilizing Thermal “Planes
and Bridges”
Here the primary topic is conduction heat transfer; you will learn to
estimate thermal impedance levels associated with filled/unfilled plated
thru hole vias, transverse/lateral thermal spreading gradients in embedded
copper layers; how to thermally bridge component case and via when conformal
coating is utilized as “filler” material; how to predict
interstitial conductance between ground plane and heat sink; you will
learn to estimate component case/junction temperature levels; how and
when to use solid core conduction cooled cards; how to select card guides
for industrial and MIL environments.
COOL 510 - Airborne Ram Air-Cooled Equipment
Design
Learn cold plate/heat sink design configured for ram air cooling; evaluate
types of ram air inlets, estimate ram air flush/scoop inlet pressure
recovery factors, calculate available ram side pressure head, and system
flow impedance ΔP; develop thermal performance maps for hot/cold day
operation from sea level to high altitude, learn significance of the
low Reynolds Number flow regime at high altitude and its effect on thermal
design; examine methods for equipment thermal conditioning at ground
static and end of runway.
COOL 511 - Airborne Environmental Control System
(ECS) Cooled Equipment Design
Here we consider cold plate/heat sink design configured for aircraft
supplied refrigerated coolant (air/liquid); you will learn to design
heat exchange equipment when supplied with limited coolant flow proportional
to heat load ; calculate air/liquid heat transfer coefficients and flow
impedance Δ when operating in flow regimes at low Reynolds Number; you
will learn to develop thermal performance maps; you will learn to identify
flow impedance Δ inflection points and their effect on induced flow and
thermal performance; also evaluate compartment ambient heat infiltration.
COOL 512 - Fan(s)/Heat Sink “Marriage”-
Design and Selection
Learn how to design natural/forced cooled air-heat sinks using spread
sheet format; calculation procedures are given for brazed/cast/ extruded/epoxied/machined
type of heat sinks; learn how to evaluate heat sink thermal performance
when operating from sea level to high altitude, using empirical data;
learn criteria for fan(s) placement…blow or pull air thru heat
sink! air-mover selection; develop thermal performance maps and flow
impedance curves over range of altitude operation.
COOL 513 - Pump/Cold Plate “Marriage”-
Design and Selection
Here participants consider liquid-cooled cold plate design; learn how
to estimate cold plate flow impedance; learn to develop thermal performance
maps; learn when to use brazed or extruded cold plate designs; learn
how to calculate piping and quick disconnect flow impedance ΔP losses;
learn about pump performance characteristics; learn how to determine
system operating point at various liquid density levels; learn to identify
when fluxless rather than salt brazing should be used.
COOL 514 - POD Thermal Management
We commence with a cursory review of thermodynamic relationships associated
with airborne platforms; static temperature, stagnation temperature, boundary
layer temperature, cold/hot day environments; learn how to evaluate the performance
of flush/scoop ram air inlets, pressure recovery, and over board “dump” loss;
duct work, heat exchanger, and plenum flow impedance ΔP levels; maximizing
useful volume when LRUs are liquid cooled; learn design features associated
with various POD cooling systems….ram air cooling, vapor cycle, expanded
ram air cycle, mold line surface.
COOL 515 - Phase Change Material (PCM)
Cooling
When packaging constraints impose thermally difficult situations, designers
utilize solid to liquid or liquid to vapor phase cooling; participants
will learn how to incorporate PCM into a packaged enclosure; they will
learn about using evaporation, boiling and/or condensing heat transfer
as the packaged primary cooling mode; they will learn how to design conditioning
equipment utilizing PCM; they will learn about heat pipe technology and
how/when to use it cost effectively; they will develop thermal performance
maps and estimate required PCM charge as related to duty cycle.
COOL 516 - Ground Mobile Shelter Air Conditioning
Perhaps you need to estimate mobile shelter total cooling/heating thermal loads;
learn how to calculate shelter roof/wall “UA” thermal conductance;
evaluate packaged air conditioning performance during extreme hot/cold day
operation ;when to use hot gas by-pass valve for load control; you will learn
to design shelter air distribution ducts; also, how to estimate duct, plenum,
and overall system flow impedance ΔP; shelter ductwork/cabinet(s) integration;
incorporate “fail soft” shelter thermal conditioning; integrating
liquid-cooled equipment and packaged liquid coolers..
COOL 517 - Humidity and Psychometrics - Protecting
Equipment
Here we commence with a review of thermodynamic and psychometric fundamentals;
relative humidity, absolute humidity, wet/dry bulb temperature, dew point
temperature; world wide humidity extremes, humidity variation with altitude;
methods for limiting moisture infiltration into electronic equipment;
how to minimize risk during exposure to accelerated life MIL-STD-810
humidity testing; learn how to avoid “rain” on equipment
when conducting humidity tests.
COOL 518 - Air and Conduction Cooled Power
Supplies
We will discuss mechanical/thermal design of air and conduction-cooled
power supplies; protecting discrete power devices; thermally integrating
electrolytics and magnetics; advantages of conduction cooled power supplies
when integrated into airborne platforms, ground based totally enclosed
cabinets, and plastic enclosures; methods for limiting power device(s)
junction temperature levels to safe and reliable levels.
COOL 519 - Cooling Shipboard Electronics
We will learn how to cool shipboard electronics when packaged in totally enclosed
and ventilated cabinets; We will learn how to calculate enclosure thermal
profiles when naturally or forced air cooled; we will learn when/how to use
shipboard water for cabinet thermal conditioning; learn to estimate cabinet
flow impedance, when to use multiple air movers; estimating induced buoyancy
flow when naturally cooled or during operating mode with fan failure; we
will discuss how to limit enclosure acoustical signatures and to minimize
risks during exposure to accelerated life MIL-STD-810 humidity testing.
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Contaminants and Corrosion
CON
501 - Contaminants and Moisture can Disrupt your Electronics
This course examines the chemical root causes (surface contamination)
of many poorly understood electronic failures. Conformal coatings, subject
to in-service failure, must be tested realistically.
COR 501
- Avoiding Corrosion
Many naturally-occurring materials, as well as certain
man-made materials, are known to attack man-made structures ranging from
highway bridges to electronic hardware, particularly when moisture is
present. We discuss how to avoid these problems.
Electrostatic Discharge (ESD)
ESD 501 - Electrostatic
Discharge
Whenever and wherever electronic hardware (particularly microelectronics)
units are handled (as for example during manufacture), electrical static
charges build up. Improperly discharged, they can seriously damage electronic
devices.
Electromagnetic Compatibility
(EMC)
EMC 510 -
Electromagnetic Compatibility
Course Goals:
- To present and explain the essential concepts of EMI (electromagnetic interference) phenomena and control.
- To explain the strengths and shortcomings of EMI control methods and components.
- To present a number of EMI prediction tools.
- To demonstrate in the classroom a number of EMI troubleshooting and measurement techniques.
- To provide a workshop forum, wherein students will directly apply learned concepts, analysis methods, and remedial tools to actual problems from their home organization.
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Measurement
DATA 501 - Environmental Data Acquisition
Basic measurement concepts, transfer functions linearity, frequency content,
waveshape reproduction non-self generating sensors, the Wheatstone Bridge,
self generating sensors, noise documentation and control, information
conversion, sampled measurements, data validation.
Pressure
PRE 501 - Dynamic Pressure
Measurements and Calibration
There are many ways to get bad data. This short course details how to
avoid these sources of error in static and especially dynamic (changing)
pressure situations. Topics include sensor selection, location, calibration
and signal processing.
PRE 510 - Pressure Calibration for the Standards Laboratory
The success of any calibration or metrology program, where calibrating pressure instrumentation is a major portion of the workload, depends on the calibration of instruments, on the documentation, on data management and retention, on quality systems, and on communications within the organization.
Whether the prospective participant is an experienced metrologist or new to the field, this 2-day course will provide him/her with useful knowledge about not only pressure calibration but for any effective and compliant calibration program.
Reliability
 HALT 534 - HALT/HASS/HASA and Practical Design FMEA
REL 501 - Reliability and Dependability – Can they be Proven?
We will consider four basic stress categories that are known to degrade electronic equipment over time
Spec
SPEC 501 – Developing Random Vibration Tests from Field Data
This course guides engineers who are given field vibration data (spacecraft, launch vehicles, aircraft, land vehicles, sea vehicles) and who are tasked to develop a random vibration test.
Strain
STR 501 - Strain
Gages
Change in physical dimension, at particular locations on structures, tells
us what the structure is doing, how it is responding to static or dynamic
loading. Gages must be properly selected and properly attached.
Gages, cabling and readout can contribute to errors. This course helps
you to avoid these errors.
Stress
STRESS 501 – Introduction to Stress Analysis
This course leads mechanical designers of such structures as buildings, vehicles and machinery an understanding of structural requirements and how to insure that those requirements are met. For practicing stress analyists, it provides a review. For recent engineering graduates it provides understanding of “the real world”.
DEV 501 - Reliability
Improvement through Step Stress
Stepwise increases of stress (most commonly random
vibration and temperature) are applied to developmental hardware. The
goal is to force weak elements to reveal themselves by failing. Once revealed,
they can be strengthened. The goal is hardware that will not fail!
If you would like to see ERI's complete
course listing, please e-mail us at tustin@equipment-reliability.com ,
subject "Request for course outlines list".
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